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3.3V Single-Piece 16Mb Nonvolatile SRAM
with Clock
Surface-mount components minimize lead inductance,
which improves performance, and ceramic capacitors
tend to have adequate high-frequency response for
Recommended Reflow Temperature
Profile
decoupling applications.
Avoiding Data Bus Contention
Care should be taken to avoid simultaneous access of
the SRAM and RTC devices (see Figure 4). Any chip-
enable overlap violates t CCS and can result in invalid
and unpredictable behavior.
Using the Open-Drain IRQ /FT
and RST Outputs
The IRQ /FT and RST outputs are open drain, and there-
fore require pullup resistors to realize a high logic out-
put level. Pullup resistor values between 1k ? and 10k ?
are typical.
Battery Charging/Lifetime
The DS3070W charges an ML battery to maximum
capacity in approximately 96 hours of operation when
V CC is greater than V TP . Once the battery is charged,
its lifetime depends primarily on the V CC duty cycle.
The DS3070W can maintain data from a single, initial
charge for up to 2 years. Once recharged, this deep-
discharge cycle can be repeated for up to 20 times,
PROFILE FEATURE
Average ramp-up rate
(T L to T P )
Preheat
- Temperature min (T Smin )
- Temperature max (T Smax )
- Time (min to max) (ts)
T Smax to T L
- Ramp-up rate
Time maintained above:
- Temperature (T L )
- Time (t L )
Peak temperature (T P )
Time within 5 ° C of actual peak
temperature (T P )
Ramp-down rate
Time 25 ° C to peak temperature
Sn-Pb EUTECTIC
ASSEMBLY
3 ° C/second max
100 ° C
150 ° C
60 to 120 seconds
183 ° C
60 to 150 seconds
225 +0/-5 ° C
10 to 30 seconds
6 ° C/second max
6 minutes max
producing a worst-case service life of 40 years. More
typical duty cycles are of shorter duration, enabling the
DS3070W to be charged hundreds of times, and
extending the service life well beyond 40 years.
Recommended Cleaning
Procedures
The DS3070W can be cleaned using aqueous-based
cleaning solutions. No special precautions are needed
when cleaning boards containing a DS3070W module.
Removal of the topside label violates the environmental
integrity of the package and voids the warranty of the
product.
V IH
Note: All temperatures refer to topside of the package, mea-
sured on the package body surface.
V IH
CE
CS
Figure 4. SRAM/RTC Data Bus Control
t CCS
V IH
V IH
t CCS
____________________________________________________________________
17
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